Printed boards and assemblies. Design use. Attachment (land/joint) considerations considerations. Generic requirements
€404.00
Printed boards and assemblies. Design use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
€193.00
Conduit systems for cable management Particular requirements. Flexible conduit
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
€316.00
BS EN IEC 63215-2. Endurance test methods for die attach materials applied to power electronics devices Part 2. Temperature cycling method and reliability performance index Die discrete type electronic
€23.00
Endurance test methods for die attach materials Temperature cycling method applied to discrete type power electronic devices
€269.00
BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices Part 4. Power cycling method (near chip interconnection) module type
Environmental testing Tests. Test Tf: Solderability of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for the most common surface mounted components (SMD)
Printed board assemblies Sectional specification. Requirements for surface mount soldered
Circuit boards and circuit board assemblies. Design use 3D shape data for CAD component library
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Surface mounting technology Standard method for the specification of components through-hole reflow (THR) soldering
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Printed board assemblies Technical cleanliness of components and printed
