Surface mounting technology Standard method for the specification of components through hole reflow (THR) soldering. Guidelines diameter design with solder paste surface printing
€269.00
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
€286.00
Printed board assemblies Application and utilization of protective coatings for electronic
€404.00
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic industries
€193.00
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021); German version EN IEC 62878-2-602:2021
€84.58
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021.
€122.34
Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
€523.00
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
€231.00
Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English
€98.32
Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
€88.00
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English
€105.42
BS EN IEC 63215-5. Endurance test methods for die attach materials Part 5. Temperature cycling (system soldering interconnection) applied to module type power electronic devices
€23.00
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019); German version EN IEC 62878-1:2019
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
€355.00
