BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
€23.00
Draft BS IEC 62271-202/AMD1 ED3 Amendment 1 - High-voltage switchgear and controlgear
BS EN IEC 63609-3 Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements Part 3: Determination for temperature measurement in using thermocouples
Draft BS EN 63609-1 Measurement method used in thermal design for electronics assemblies Part 1: requirements the circuit boards or with miniaturized SMDs where heat dissipation path to board is dominant
Draft BS EN 63609-2 Measurement method used in thermal design for electronics assemblies Part 2: conductivity of circuit boards with polymer composites
Draft BS EN 61249-2-55 Materials for printed boards and other interconnecting structures Part 2-55. Reinforced base materials clad unclad. Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) flammability (vertical burning test), copper-clad
Draft BS EN IEC 61191-10-2 ED1 Circuit board assemblies Part 10-2 : Guideline for the Output Profile Design in Laser-Assisted Bonding
Environmental testing - Part 2-83 : tests - Test Tf : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
€126.00
