Electronic components general. Guide for application of the french document C 90-551. Alloys, fluxes and creams for soft soldering test methods.
€141.50
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice (IEC 60917-2:1992); German version EN 60917-2:1994
€69.91
Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
€67.00
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
€90.00
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices
€176.00
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English
€84.58
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 91/1637/CDV:2020); German and English version prEN IEC 61188-6-2:2020
€116.64
Endurance test methods for die attach materials applied to power electronics devices - Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices (IEC 91/1660/CD:2020); Text in German and English
€105.42
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials (IEC 91/1634/CD:2019); Text in German and English
€98.32
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA (IEC 91/1647/CD:2020); Text in German and English
€63.27
Device Embedding Assembly Technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 91/1629/CD:2019); Text in German and English
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 91/1554/CD:2018); Text in German and English
€122.34
Space product assurance - High-reliability soldering for surface-mount and mixed technology
€267.50
Device embedded substrate - Part 2-5: Implementation of a 3D data format for device embedded substrate (IEC 91/1522/CD:2018); Text in German and English
€162.06
Device embedded substrate - Generic specification (IEC 91/1509/CD:2018); Text in German and English
