Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength
€193.00
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
€127.00
Electronics assembly technology - Electronic modules
€88.00
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
Printed board design, manufacture and assembly. Terms and definitions
€404.00
Test methods for electrical materials, interconnection structures and assemblies materials used in manufacturing electronic
€316.00
Complete filter units for radio interference suppression Blank detail specification. Passive electromagnetic suppression. Filters which safety tests are required (Assessment level D/DZ)
Complete filter units for radio interference suppression Blank detail specification. Passive electromagnetic suppression. Filters which safety tests are required (safety only)
Printed boards and printed board assemblies - Design and use - Part 5-2 : attachment (land/joint) considerations - Discrete components - Cartes imprimées et cartes imprimées équipées
€128.67
Printed boards and assemblies. Design use. Attachment (land/joint) considerations Discrete components
€374.00
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-6 : considérations sur les liaisons pistes-soudures - Composants à sorties en J sur quatre côtés
€82.00
Printed boards and assemblies. Design use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
€369.00
