Modular order for the development of mechanical structures for electronic equipment practices; part 0: guide for the users of IEC 917 (IEC 60917-0:1989); german version EN 60917-0:1992
€77.20
Modular order for the development of mechanical structures for electronic equipment practices (IEC 60917:1988); german version EN 60917:1990
€63.27
IEC TR 62878-2-2:2015 Device embedded substrate - Part 2-2: Guidelines - Electrical testing
€93.00
IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
€389.00
IEC 60068-2-69:2017/AMD1:2019 Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
€23.00
IEC 61190-1-3:2017 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
€342.00
IEC 60068-2-69:2017/COR1:2018 Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)
€0.00
IEC 61760-4:2015/AMD1:2018 Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
€12.00
IEC 62878-2-602:2021 Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
IEC 60068-2-21:2021 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
€77.00
Essais d'environnement - Partie 2-83 : Essais - Essai Tf : Essai de brasabilité des composants électroniques pour les composants montés en surface (CMS) par la méthode de la balance de mouillage utilisant de la pâte à braser
€138.00
Printed boards and printed board assemblies - Design and use - Part 7 : electronic component zero orientation for CAD library construction
€111.67
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
