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IEC 60068-2-69:2017/AMD1:2019
IEC 60068-2-69:2017/AMD1:2019 Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 06/19/2019 |
| Edition | 3.0 |
| Page Count | 13 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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