Electronics assembly technology - Part 4 : endurance test methods for solder joint of area array type package surface mount devices
€138.00
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
€355.00
Device embedded substrate - Part 1-1: Generic specification - Test methods
€369.00
Device embedded substrate Guidelines. General description of technology
€316.00
Device embedded substrate Guidelines. Test element groups (TEG)
Device embedded substrate Guidelines. Design guide
€269.00
Device embedded substrate - Part 2-1: Guidelines - General description of technology
€231.00
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
€286.00
Device embedded substrate - Part 2-3: Guidelines - Design guide
€176.00
Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014.
€105.42
Techniques d'assemblage des composants électroniques - Modules électroniques
€95.67
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
€325.00
Attachment materials for electronic assembly - Part 1-2 : requirements for soldering pastes for high-quality interconnects in electronics assembly
€111.67
Attachment materials for electronic assembly Requirements soldering pastes high-quality interconnects in electronics
