IEC 61192-1: Printed board assemblies - Part 1: Generic specification: Workmanship requirements and guidelines for soldered electronic assemblies (IEC 91/151/CD:1998)
€128.22
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solder for electronic soldering applications (IEC 91/521/CD:2005)
€116.64
Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly (IEC 91/520/CD:2005)
€91.03
Electronic Modules - Generic standard (IEC 91/546/CD:2005)
€77.20
Amendment to IEC 60749 "Update of Chapter 2 subclause 2.3: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat" and of Chapter 3 clause 5: "Sealing"
€122.34
IEC 60068-2-88:2025 Environmental testing - Part 2-88: Tests – Test XD: Resistance of components and assemblies to liquid cleaning media
€302.00
IEC 60068-2-83:2025 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
SMD - Surface Mount Devices - Process measurement and testing for printed circuit boards (PCB)
€128.28
IEC 61188-6-3:2024 Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (IEC 63215-2:2023); German version EN IEC 63215-2:2023
€111.40
IEC 62878-2-603:2025 Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
€93.00
Technique du montage en surface - Partie 4 : Classification, emballage, étiquetage et manipulation des dispositifs sensibles à l'humidité
€116.50
Technique du montage en surface – Partie 1 : Méthode normalisée pour la spécification des composants pour montage en surface (CMS)
€105.50
IEC 61191-1:2018 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
€342.00
Matériaux de fixation pour les assemblages électroniques - Partie 1-3 : exigences relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et non fluxées pour les applications de brasage électronique
€77.67
