Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
€11.00
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
€506.00
Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
€325.00
Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design (IEC 91/1452/CD:2017)
€150.65
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 91/1319/CD:2015)
€105.42
Device embedded substrate. Guidelines. Data format
€316.00
Device embedded substrate - Guidelines - Data format
€286.00
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/1231/CD:2014)
€140.00
Printed board design, manufacture and assembly - Terms and definitions
€523.00
Requirements for a COTS Assembly Management Plan
€109.00
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 7 : orientation nulle des composants électroniques pour l'élaboration de la bibliothèque CAO
€111.67
Ensembles de cartes imprimées - Partie 2 : spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surface
Printed board assemblies - Part 1 : generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
€153.00
Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 91/1110/CD:2013)
€98.32
