Printed board assemblies - Part 2 : sectional specification - Requirements for surface mount soldered assemblies
€127.67
Product package labels for electronic components using bar code and two-dimensional symbologies
€116.33
Space product assurance - High-reliability soldering for surface-mount and mixed technology
€261.00
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018); German version EN IEC 61189-2-630:2018
€63.27
Device embedded substrate - Part 2-5: Implementation of a 3D data format for device embedded substrate (IEC 91/1522/CD:2018); Text in German and English
€162.06
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 91/1554/CD:2018); Text in German and English
€122.34
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019); German version EN IEC 61188-6-4:2019
€140.00
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017/COR1:2019); German version EN 61191-2:2017/AC:2019
€0.00
Device embedded substrate - Generic specification (IEC 91/1509/CD:2018); Text in German and English
€105.42
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
€76.00
Electronics assembly technology - Part 3 : selection guidance of environmental and endurance test methods for solder joints
€153.00
Environmental testing - Part 2-69 : tests - Test Te/Tc : solderability testing of electronic components and printed boards by the wetting balance (force measurement) method - Essais d'environnement : Partie 2-69 : Essais - Essai Te : Essai de brasabilité des composants et cartes électroniques par la méthode de la balance de mouillage (mesure de la force)
€166.33
IEEE Mechanical Standard for Conduction-Cooled and Air-Cooled 10 SU Modules
€146.00
IEEE Standard for Military Module, Format E Form Factor
IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
€186.00
