Workmanship requirements for soldered electronic assemblies - Part 1: General
€418.00
Product performance requirements - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 91/326/CD:2002)
€116.64
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronic assembly (IEC 61190-1-2:2002); German version EN 61190-1-2:2002.
€91.03
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2002); German version EN 61190-1-3:2002.
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
€325.00
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
€231.00
Product package labels for electronic components using bar code and two-dimensional symbologies
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies (IEC 91/315/CD:2002)
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 91/310/CD:2002)
€150.65
Amendment 2 to IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 91/313/CD:2002)
€122.34
Matériaux de fixation pour les assemblages électroniques - Partie 1-2 : exigences relatives aux crèmes de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques
€95.67
Matériaux de fixation pour les assemblages électroniques - Partie 1-3 : exigences relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et non-fluxées pour les applications de brasage électronique
Attachment materials for electronic assembly Requirements solder pastes high-quality interconnections in
€193.00
Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid solders soldering applications
€316.00
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements