31.190 : Electronic component assemblies

IEC 61192-1:2003

IEC 61192-1:2003

Withdrawn Most Recent

Workmanship requirements for soldered electronic assemblies - Part 1: General

€418.00

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DIN IEC 61192-5:2003-02

DIN IEC 61192-5:2003-02

Superseded Historical

Product performance requirements - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 91/326/CD:2002)

€116.64

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DIN EN 61190-1-2:2003-01

DIN EN 61190-1-2:2003-01

Superseded Historical

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronic assembly (IEC 61190-1-2:2002); German version EN 61190-1-2:2002.

€91.03

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DIN EN 61190-1-3:2003-01

DIN EN 61190-1-3:2003-01

Superseded Historical

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2002); German version EN 61190-1-3:2002.

€116.64

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IEC 61192-3:2002

IEC 61192-3:2002

Withdrawn Most Recent

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

€325.00

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IEC 61192-4:2002

IEC 61192-4:2002

Withdrawn Most Recent

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

€231.00

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IEC 62090:2002

IEC 62090:2002

Superseded Historical

Product package labels for electronic components using bar code and two-dimensional symbologies

€325.00

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DIN IEC 61189-6:2002-11

DIN IEC 61189-6:2002-11

Superseded Historical

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies (IEC 91/315/CD:2002)

€116.64

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DIN IEC 61189-5:2002-11

DIN IEC 61189-5:2002-11

Superseded Historical

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 91/310/CD:2002)

€150.65

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DIN IEC 61189-2/A2:2002-10

DIN IEC 61189-2/A2:2002-10

Superseded Historical

Amendment 2 to IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 91/313/CD:2002)

€122.34

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NF EN 61190-1-2, C90-700-1-2 (09/2002)

NF EN 61190-1-2, C90-700-1-2 (09/2002)

Superseded Historical

Matériaux de fixation pour les assemblages électroniques - Partie 1-2 : exigences relatives aux crèmes de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques

€95.67

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NF EN 61190-1-3, C90-700-1-3 (09/2002)

NF EN 61190-1-3, C90-700-1-3 (09/2002)

Superseded Historical

Matériaux de fixation pour les assemblages électroniques - Partie 1-3 : exigences relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et non-fluxées pour les applications de brasage électronique

€95.67

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BS EN 61190-1-2:2002

BS EN 61190-1-2:2002

Superseded Historical

Attachment materials for electronic assembly Requirements solder pastes high-quality interconnections in

€193.00

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BS EN 61190-1-3:2002

BS EN 61190-1-3:2002

Superseded Historical

Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid solders soldering applications

€316.00

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IEC 61188-5-1:2002

IEC 61188-5-1:2002

Superseded Historical

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

€418.00

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