31.190 : Electronic component assemblies

IEC 60194-2:2025

IEC 60194-2:2025

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IEC 60194-2:2025 Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies

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IEC 60194-2:2017

IEC 60194-2:2017

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IEC 60194-2:2017 Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

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IEC TR 62878-2-7:2019

IEC TR 62878-2-7:2019

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IEC TR 62878-2-7:2019 Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

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IEC 62878-2-5:2019

IEC 62878-2-5:2019

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IEC 62878-2-5:2019 Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

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IEC 61191-2:2017/COR1:2019

IEC 61191-2:2017/COR1:2019

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IEC 61191-2:2017/COR1:2019 Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

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IEC 62878-1:2019

IEC 62878-1:2019

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IEC 62878-1:2019 Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

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IEC TR 61191-7:2020

IEC TR 61191-7:2020

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IEC TR 61191-7:2020 Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

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IEC 62739-3:2017

IEC 62739-3:2017

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IEC 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

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IEC 62090:2017

IEC 62090:2017

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IEC 62090:2017 Product package labels for electronic components using bar code and two-dimensional symbologies

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IEC 61191-2:2017

IEC 61191-2:2017

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IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

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IEC 60068-2-58:2015/AMD1:2017

IEC 60068-2-58:2015/AMD1:2017

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IEC 60068-2-58:2015/AMD1:2017 Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

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SAE EIA 933B:2015-03-01

SAE EIA 933B:2015-03-01

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Requirements for a COTS Assembly Management Plan

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IEC 60068-2-77:1999

IEC 60068-2-77:1999

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IEC 60068-2-77:1999 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

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IEC 60068-2-21:2006

IEC 60068-2-21:2006

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IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

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IEC 60068-2-69:2007

IEC 60068-2-69:2007

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IEC 60068-2-69:2007 Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

€186.00

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