IEC TR 62878-2-7:2019
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IEC TR 62878-2-7:2019

IEC TR 62878-2-7:2019 Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Summary

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 03/20/2019
Edition 1.0
Page Count 12
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ISBN ---
Weight (in grams) ---
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