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IEC 62878-1:2019
IEC 62878-1:2019 Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
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Summary
IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 10/14/2019 |
| Edition | 1.0 |
| Page Count | 19 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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