IEC TR 61191-7:2020
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IEC TR 61191-7:2020

IEC TR 61191-7:2020 Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

Summary

IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 03/11/2020
Edition 1.0
Page Count 115
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Weight (in grams) ---
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