Superseded
Standard
Historical
IEC 61190-1-3:2002
Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Preview
Summary
Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 03/22/2002 |
| Release Date | 03/22/2002 |
| Cancellation Date | 04/26/2007 |
| Edition | 1 |
| Page Count | 65 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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Previous versions
10/06/2010
Superseded
Historical
10/11/2010
Superseded
Historical
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