IEC 61190-1-3:2007/AMD1:2010
Superseded Standard amendment
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IEC 61190-1-3:2007/AMD1:2010

Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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Publisher International Electrotechnical Commission (IEC)
Publication Date 06/10/2010
Release Date 06/10/2010
Cancellation Date 12/13/2017
Edition 2
Page Count 17
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Weight (in grams) ---
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