Superseded
Standard
Historical
IEC PAS 62137-3:2008
Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
Preview
Summary
IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 11/13/2008 |
| Release Date | 11/13/2008 |
| Cancellation Date | 11/08/2011 |
| Edition | 1 |
| Page Count | 41 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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