Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling (IEC 91/1152/CD:2013)
€84.58
Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering Flux (IEC 91/1070/CD:2012)
€145.14
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description (IEC 61182-2-2:2012); German version EN 61182-2-2:2012
€150.65
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-27:2012); German version EN 61249-2-27:2013
€105.42
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (IEC 61249-2-30:2012); German version EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-39:2012); German version EN 61249-2-39:2013
€111.40
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-40:2012); German version EN 61249-2-40:2013
Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste (IEC 91/1071/CD:2012)
€134.02
Printed boards - Part 16: Device Embedded Substrate Technology - Generics (IEC 91/1081/CD:2013)
€98.13
Printed boards - Part 17: Device embedded substrates - TEG (test element group) (IEC 91/1082/CD:2013)
€102.52
Printed boards - Part 18: Standard on Device Embedded Substrate - Test methods (IEC 91/1083/CD:2013)
€128.22
Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire (IEC 91/1072/CD:2012)
€98.32
Printed boards - Part 19: Device Embedded Substrate - Design Guide (IEC 91/1084/CD:2013)
€89.16
Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide nonwoven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/1100A/CD:2013)
Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/1099/CD:2013)
