Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad; epoxide non-woven aramid laminate of defined flammability, copper-clad (IEC 61249-2-12:1999); German version EN 61249-2-12:1999
€84.58
Harmonized system of quality assessment for electronic components. Technology approval schedule. Film and hybrid integrated circuits
€316.00
Materials for interconnection structures. Sectional specification set reinforced base materials, clad and unclad Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
€193.00
Materials for interconnection structures. Sectional specification set reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad
Materials for interconnection structures. Sectional specification set unreinforced base materials, clad and unclad (intended flexible printed boards) Transfer adhesive films boards
Materials for interconnection structures. Sectional specification set unreinforced base materials, clad and unclad (intended flexible printed boards) Adhesive coated polyimide film
Materials for interconnection structures. Sectional specification set unreinforced base materials, clad and unclad (intended flexible printed boards) Adhesive coated polyester film
PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS. SECTIONAL SPECIFICATION.
€88.00
PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION. SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B, AND C
€119.00
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements; controlled impedance (IEC 61188-1-2:1998); German version EN 61188-1-2:1998
€105.42
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
Connectors for frequencies below 3 MHz for use with printed boards. Part 2 : detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0.1 in) with common mounting features.
€198.33
