Test Method for Determining the Electrical Resistivity of a Printed Conductive Material (Withdrawn 2023)
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Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure (Withdrawn 2023)
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020)
Printed boards and printed board assemblies. Design use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
€355.00
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
€269.00
Mechanical standardization of semiconductor devices Glossary tests and burn-in sockets for BGA, LGA, FBGA FLGA
€165.00
Printed board design, manufacture and assembly. Terms and definitions
€404.00
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Measurement of relative permittivity loss tangent copper clad laminate at microwave frequency using split post dielectric resonator
Test methods for electrical materials, printed boards and other interconnection structures assemblies (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
€193.00
Qualification and performance of electrical insulating compound for printed wiring assemblies
Qualification and performance specification of permanent solder mask and flexible cover materials
Low-voltage switchgear and controlgear Contactors motor-starters. AC semiconductor controllers contactors for non-motor loads
Device embedded substrate Guidelines. General description of technology
€316.00
