Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 61189-3-302:2025); German version EN IEC 61189-3-302:2025
€98.32
Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications (IEC 91/2052/CDV:2025); German and English version prEN IEC 61249-2-54:2025
€111.40
BS EN IEC 62899-202-7 Printed electronics Part 202-7: Materials - film Measurement of peel strength for printed layer on flexible substrate by 90° method
€23.00
Materials for circuit boards and other interconnecting structures Sectional specification set unreinforced base materials clad unclad. Polytetrafluoroethylene (PTFE) filled laminate sheets of defined flammability (vertical burning test), copper-clad
€269.00
BS EN IEC 61249-2-56 Materials for printed boards and other interconnecting structure Part 2-56: Reinforced base materials clad unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion flammability (vertical burning test), copper-clad IC substrate
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 61188-6-3:2024); German version EN IEC 61188-6-3:2025.
€122.34
Materials for printed boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials, clad and unclad - PTFE filled laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 91/2015/CDV:2025); German and English version prEN IEC 61249-3-6:2025
Printed electronics Printability. Measurement of qualities. Shape pattern dimension
€316.00
Materials for circuit boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials clad and unclad - Polytetrafluoroethylene (PTFE) filled laminate sheets of defined flammability (vertical burning test), copper-clad
€127.00
An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test
€77.00
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - Semiconductor controllers and semiconductor contactors for non-motor loads
€138.00
Printed electronics Part 403-2: Printability - Requirements for reproducibility Basic patterns printing plate
Printed electronics - Part 403-2: Printability - Requirements for reproducibility - Basic patterns for printing plate
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 62878-2-603:2025); German version EN IEC 62878-2-603:2025
€91.03
Fixed folding durability test method for flexible opto-electric circuit boards (IEC 91/2046/CDV:2025); German and English version prEN IEC 63516:2025
