Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
€88.00
Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies
€325.00
Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for through hole components (THT)
€316.00
Test methods for electrical materials, circuit boards and other interconnection structures assemblies X/Y coefficient of thermal expansion (CTE) test thick base materials by TMA
€165.00
BS EN IEC 61189-3-720 Test methods for electrical materials, printed boards and other interconnection structures assemblies Part 3-720: (circuit boards) - Transmission loss test method high frequency multilayer circuit
€23.00
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 61189-2-720:2024); German version EN IEC 61189-2-720:2024
€77.20
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-3 : conception de la zone de report - Description de la zone de report pour les composants à trous traversants (THT)
€126.00
Méthodes d'essai pour les matériaux électriques, les circuits imprimés et autres structures d'interconnexion et ensembles - Partie 2-809 : essai du coefficient de dilatation thermique (CTE) X/Y pour matériaux de base épais à l'aide d'un analyseur thermomécanique (TMA)
€77.67
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
Low-voltage switchgear and controlgear Contactors motor-starters. Semiconductor controllers semiconductor contactors for non-motor loads
€404.00
BS IEC 62899-202-13 Printed electronics Part 202-13: Materials - Resistance measurement method for conductive layer in printed and in-mould
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
€286.00
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
€44.00
IEEE Draft Standard for a Mixed-Signal Test Bus
€117.00
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-52 : matériaux de base renforcés, métallisés et non métallisés - Feuilles stratifiées renforcées en tissu de verre de type E avec système de résines hydrocarbonées thermodurcissables, d'inflammabilité définie (essai de combustion verticale), plaquées cuivre
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