31.180 : Printed circuits and boards

DIN EN IEC 61189-2-501:2023-12

DIN EN IEC 61189-2-501:2023-12

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022); German version EN IEC 61189-2-501:2022

€98.32

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23/30450091 DC:2023

23/30450091 DC:2023

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BS IEC 62899-203-2 Printed electronics Materials - Semiconductor Ink- Space charge limited mobility measurement in printed organic semiconductive layers

€23.00

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NF EN IEC 63251, C93-737 (12/2023)

NF EN IEC 63251, C93-737 (12/2023)

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Méthode d'essai des propriétés mécaniques des circuits optoélectriques souples sous contrainte thermique

€111.67

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BS EN IEC 63203-401-1:2023

BS EN IEC 63203-401-1:2023

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Wearable electronic devices and technologies Devices systems: functional elements. Evaluation method of the stretchable resistive strain sensor

€355.00

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23/30483578 DC:2023

23/30483578 DC:2023

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BS IEC 62899-202-11. Printed electronics Part 202-11. Materials. Conductive ink. Measurement method of electrical resistance uniformity for large area printed conductive layer

€23.00

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BS IEC 63055:2023

BS IEC 63055:2023

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Format for LSI-Package-Board Interoperable design

€404.00

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IEC 63251:2023

IEC 63251:2023

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Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

€176.00

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BS IEC 62899-202-9:2023

BS IEC 62899-202-9:2023

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Printed electronics Materials. Conductive ink. patterns for mechanical test

€193.00

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23/30436874 DC:2023

23/30436874 DC:2023

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BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity

€23.00

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IEC 63055:2023

IEC 63055:2023

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Format for LSI-Package-Board Interoperable design

€523.00

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NF EN IEC 61189-2-804, C93-732-804 (10/2023)

NF EN IEC 61189-2-804, C93-732-804 (10/2023)

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Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-804 : méthodes d'essai pour le temps de décollement interlaminaire - T260, T288, T300

€77.67

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BS EN IEC 61189-2-803:2023

BS EN IEC 61189-2-803:2023

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Test methods for electrical materials, printed boards and other interconnection structures assemblies Z-axis expansion of base materials

€165.00

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23/30479769 DC:2023

23/30479769 DC:2023

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BS EN IEC 61249-2-52 Materials for printed boards and other interconnecting structures Part 2-52. Reinforced base materials clad unclad. Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad

€23.00

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NF EN IEC 61189-2-801, C93-732-801 (09/2023)

NF EN IEC 61189-2-801, C93-732-801 (09/2023)

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Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-801 : essai de conductivité thermique pour matériaux de base

€77.67

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NF EN IEC 61189-2-803, C93-732-803 (09/2023)

NF EN IEC 61189-2-803, C93-732-803 (09/2023)

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Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-803 : méthodes d'essai pour la dilatation suivant l'axe Z des matériaux de base et des cartes imprimées

€77.67

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