Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes
€269.00
Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
€316.00
Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
Materials for interconnection structures. Sectional specification set non-conductive films and coatings Marking legend inks
€193.00
Materials for interconnection structures. Sectional specification set conductive foils and films with without coatings Conductive inks
Printed boards Rigid multilayer printed with interlayer connections. Sectional specification
Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
€374.00
Harmonized system of quality assessment for electronic components. Generic specification: printed boards
€283.00
Materials for interconnection structures. Sectional specification set non-conductive films and coatings Temporary polymer
€165.00
Printed boards and assemblies. Design use. Generic requirements Flatness considerations for electronic assemblies
Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections
