31.180 : Printed circuits and boards

BS CECC 23600-801:1998

BS CECC 23600-801:1998

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Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections

€269.00

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BS CECC 23300-801:1998

BS CECC 23300-801:1998

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Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards

€316.00

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BS CECC 23200-801:1998

BS CECC 23200-801:1998

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Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plated through holes

€269.00

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BS CECC 23100-801:1998

BS CECC 23100-801:1998

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Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plain holes

€269.00

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BS CECC 23700-801:1998

BS CECC 23700-801:1998

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Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections

€193.00

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BS CECC 200025:1998

BS CECC 200025:1998

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Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities

€316.00

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BS EN 61188-1-2:1998

BS EN 61188-1-2:1998

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Printed boards and assemblies. Design use. Generic requirements requirements. Controlled impedance

€316.00

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BS 6221-6:1982

BS 6221-6:1982

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Printed wiring boards Specification for multilayer printed

€269.00

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BS 6221-1:1990

BS 6221-1:1990

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Printed wiring boards Guide for the specification writer

€165.00

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BS 4584-103.2:1990

BS 4584-103.2:1990

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Metal-clad base materials for printed wiring boards. Special used in connection with circuits Specification copper foil use the manufacture of copper-clad

€165.00

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BS EN 60079-27:2008

BS EN 60079-27:2008

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Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)

€193.00

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BS EN 61249-2-11:2003

BS EN 61249-2-11:2003

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Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

€269.00

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BS EN 61249-2-35:2009

BS EN 61249-2-35:2009

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Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly

€269.00

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BS EN 61249-2-5:2003

BS EN 61249-2-5:2003

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Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad Brominated epoxide cellulose paper reinforced core/woven E-glass surfaces laminated sheets of defined flammability (vertical burning test), copper-clad

€269.00

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BS EN 61249-2-10:2003

BS EN 61249-2-10:2003

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Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

€269.00

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