Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-501 : méthodes d'essai des matériaux pour structures d'interconnexion - Mesure de la puissance élastique et du facteur de rétention de la puissance élastique des matériaux diélectriques flexibles
€95.67
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
€88.00
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
€269.00
BS EN IEC 63203-402-3. Wearable electronic devices and technologies Part 402-3. Performance measurement method of wearables. Series 2: Accuracy Heart Rate Determination
€23.00
BS EN IEC 63203-402-2. Wearable electronic devices and technologies Part 402-2. Performance Measurement of Fitness Wearables. Step Counting
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Decomposition temperature (Td) using TGA
€165.00
Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
€193.00
BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method
Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
€176.00
Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of stretchable substrates
€44.00
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019); German version EN IEC 62878-1:2019
€105.42
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807 : Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA
€77.96
Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
€127.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 61189-5-504:2020); German version EN IEC 61189-5-504:2020
€111.40
