Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad Brominated epoxide non-woven/woven E-glass glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
€269.00
Materials for interconnection structures. Sectional specification set reinforced base materials, clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
Optical circuit boards General
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
€193.00
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
Performance guide for single- and double-sided flexible printed wiring boards
€355.00
Materials for printed boards and other interconnecting structures Copper-clad laminates flexible (adhesive non-adhesive types)
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA measurement methods
€316.00
Printed boards and printed board assemblies. Design use Attachments (land/joint) considerations. Components with J leads on two sides
Printed boards and printed board assemblies. Design use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
