31.180 : Printed circuits and boards

DIN IEC 60194:1992-11

DIN IEC 60194:1992-11

Withdrawn Most Recent

Printed circuits; terms and definition; identical with IEC 60194:1988

€134.02

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BS EN 60249-2-19:1993

BS EN 60249-2-19:1993

Withdrawn Most Recent

Specifications Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication multilayer printed boards

€193.00

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IEC 60326-12:1992

IEC 60326-12:1992

Withdrawn Most Recent

Printed boards - Part 12: Specification for mass lamination panels (semi-manufactured multilayer printed boards)

€127.00

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NF C01-541 (08/1992)

NF C01-541 (08/1992)

Withdrawn Most Recent

Vocabulaire électrotechnique - Chapitre 541 : circuits imprimés

€77.67

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DIN IEC 60326-2:1992-07

DIN IEC 60326-2:1992-07

Withdrawn Most Recent

Printed boards; part 2: test methods; identical with IEC 60326-2:1990

€111.40

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IEC 60326-2:1990/AMD1:1992

IEC 60326-2:1990/AMD1:1992

Withdrawn Most Recent

Amendment 1 - Printed boards. Part 2: Test methods

€11.00

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IEC 60249-2-17:1992/COR1:1992

IEC 60249-2-17:1992/COR1:1992

Superseded Historical

Corrigendum 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

€0.00

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BS 6221-24:1992

BS 6221-24:1992

Withdrawn Most Recent

Printed wiring boards Guide for the production of artwork

€193.00

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BS 4584-103.3:1992

BS 4584-103.3:1992

Withdrawn Most Recent

Metal-clad base materials for printed wiring boards. Special used in connection with circuits Specification permanent polymer coating (solder resist) use the fabrication of boards

€193.00

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IEC 60249-2-16:1992

IEC 60249-2-16:1992

Superseded Historical

Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

€88.00

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IEC 60249-2-18:1992

IEC 60249-2-18:1992

Superseded Historical

Base materials for printed circuits - Part 2: Specifications - Specification No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

€88.00

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IEC 60249-2-19:1992

IEC 60249-2-19:1992

Superseded Historical

Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

€88.00

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DIN IEC 52(Sec)352:1992-03

DIN IEC 52(Sec)352:1992-03

Superseded Historical

Base materials for printed circuits; special materials; specification no. 2: copper foil for use in the manufacture of copper-clad base materials; identical with IEC 52(Secretariat)352

€63.27

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IEC 60249-2-17:1992

IEC 60249-2-17:1992

Superseded Historical

Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

€88.00

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DIN EN 123000:1992-02

DIN EN 123000:1992-02

Withdrawn Most Recent

Generic specification: printed boards; german version EN 123000:1991

€77.20

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