31.180 : Printed circuits and boards

BS EN 123200-800:1992

BS EN 123200-800:1992

Superseded Historical

Harmonized system of quality assessment for electronic components: capability detail specification: single and double sided printed boards with plated-through holes

€269.00

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DIN IEC 60326-1:1990-08

DIN IEC 60326-1:1990-08

Withdrawn Most Recent

Printed boards; general information for the specification writer; identical with IEC 60326-1:1984

€48.79

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BS 4584-102-102.6:1990

BS 4584-102-102.6:1990

Superseded Historical

Metal-clad base materials for printed wiring boards. Copper-clad Specification phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)

€269.00

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BS 4584-102-102.5:1990

BS 4584-102-102.5:1990

Superseded Historical

Metal-clad base materials for printed wiring boards. Copper-clad Specification epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

€165.00

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IEEE 1149.1:1990

IEEE 1149.1:1990

Superseded Historical

IEEE Standard Test Access Port and Boundary-Scan Architecture

€149.00

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IEC 60326-2:1990

IEC 60326-2:1990

Withdrawn Most Recent

Printed boards. Part 2: Test methods

€418.00

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BS 4584-102-102.7:1990

BS 4584-102-102.7:1990

Superseded Historical

Metal-clad base materials for printed wiring boards. Copper-clad Specification phenolic cellulose copper-clad laminated sheet of defined flammability (vertical burning test)

€165.00

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BS EN 60249-2-13:1994

BS EN 60249-2-13:1994

Withdrawn Most Recent

Base material for printed circuits. Specifications Flexible copper-clad polyimide film, general purpose grade

€193.00

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BS 4584-103.1:1990

BS 4584-103.1:1990

Withdrawn Most Recent

Metal-clad base materials for printed wiring boards. Special used in connection with circuits Specification prepreg use as a bonding sheet material the fabrication of multilayer board

€95.00

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IEC 60326-6:1980/AMD2:1990

IEC 60326-6:1980/AMD2:1990

Superseded Historical

Amendment 2 - Printed boards. Part 6: Specification for multilayer printed boards.

€88.00

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ASTM D3380-90(2003)

ASTM D3380-90(2003)

Superseded Historical

Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates

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IEC 60194:1988/COR1:1990

IEC 60194:1988/COR1:1990

Superseded Historical

Corrigendum 1 - Terms and definitions for printed circuits

€0.00

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IEC 60249-2-9:1987/AMD2:1990

IEC 60249-2-9:1987/AMD2:1990

Superseded Historical

Amendment 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

€11.00

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IEC 60326-7:1981/AMD1:1989

IEC 60326-7:1981/AMD1:1989

Withdrawn Most Recent

Amendment 1 - Printed boards. Part 7: Specification for single and double sided flexible printed boards without through connections

€11.00

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IEC 60326-8:1981/AMD1:1989

IEC 60326-8:1981/AMD1:1989

Withdrawn Most Recent

Amendment 1 - Printed boards. Part 8: Specification for single and double sided flexible printed boards with through connections

€11.00

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