Printed boards and printed board assemblies. Design use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
€269.00
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
Optical amplifiers. Test methods Gain transient parameters. Broadband source method
Optical circuit boards Interface standards. General and guidance
€316.00
Optical circuit boards Performance standards. General and guidance
€193.00
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
€374.00
Test methods for electrical materials, printed boards and other interconnection structures assemblies Measurement of melting temperature or ranges solder alloys
Printed boards Device embedded substrate. Terminology / reliability design guide
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. High performance epoxide non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed fabrication
€355.00
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
