Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Reflow soldering ability solder joint, reflow heat resistance
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Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for the most common surface mounted components (SMD)
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IEC TR 61191-8:2021 Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
€286.00
Test methods for electrical materials, printed board and other interconnection structures assemblies General test materials assemblies. Surface insulation resistance (SIR) testing of
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Surface insulation resistance (SIR) testing of solder fluxes
Printed electronics Materials. film. Measurement of peel strength for printed layer on flexible substrate by the 90° method
€193.00
Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
€88.00
Printed boards and printed board assemblies - Design and use - Part 6-2 : land pattern design - Description of land pattern for the most common surface mounted components (SMD) - Cartes à circuit imprimé et cartes à circuit imprimé équipées - Conception et utilisation - Partie 6-2 : conception de la zone de report - Description de la zone de report pour les composants montés en surface (CMS) les plus courants
€111.67
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-501 : méthodes d'essai générales pour les matériaux et les ensembles - Essais de résistance d'isolement en surface (RIS) des flux de brasage
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
€523.00
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
€176.00
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
