BS EN IEC 63251. Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress
€23.00
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
€269.00
Wearable electronic devices and technologies Smart body area network (SmartBAN). Enhanced ultra-low power physical layer
€193.00
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
BS EN IEC 61189-2-805. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-805. X/Y CTE Thin Base Materials by TMA
Printed board assemblies Voiding in solder joints of printed for use automotive electronic control units. Best practices
€316.00
Test methods for electrical materials, printed board and other interconnection structures assemblies Thermal resistance of an assembly by thermal transient method
Printed electronics Materials. Conductive ink
Test methods for electrical materials, printed boards and other interconnection structures assemblies X/Y CTE test thin base materials by TMA
€165.00
BS EN IEC 63203-402-3. Wearable electronic devices and technologies Part 402-3. Performance measurement method of wearables. Series 2: Accuracy Heart Rate Determination
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic industries
Printed electronics Materials. Conductive ink. Measurement of difference in resistance printing direction conductive film fabricated with wire-shaped materials
BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Printed electronics Materials. Resistance measurement method for thermoformable conducting layer
BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-809. X/Y Coefficient of Thermal Expansion (CTE) Thick Base Materials by TMA
