Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018); German version EN IEC 61189-2-630:2018
€63.27
Low-voltage switchgear and controlgear - Part 7-4 : ancillary equipment - PCB terminal blocks for copper conductors
€117.00
BS EN 63203-406-1. Wearable electronic devices and technologies Part 406-1. Test methods of wrist worn wearable for measuring skin contact temperature
€23.00
Printed electronics Materials. Conductive ink. Measurement of sheet resistance conductive films. Contactless method
€193.00
Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method
€88.00
Printed electronics Materials. Substrates
€355.00
BS EN IEC 61249-6-3. Materials for printed boards and other interconnecting structures Part 6-3. Sectional specification set reinforcement materials. Specification finished fabric woven from “E” glass
BS EN IEC 61189-2-803. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-803. Z-Axis Expansion of base materials
Printed electronics - Part 201: Materials - Substrates
€704.00
Amendment 1 - Printed electronics - Part 201: Materials - Substrates
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
Test methods for electrical materials, printed board and other interconnection structures assemblies materials structures. Moisture absorption after pressure vessel conditioning
€165.00
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-630 : méthodes d'essai des matériaux pour structures d'interconnexion - Absorption d'humidité après conditionnement dans un récipient sous pression
€59.33
Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
