Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Base materials integrated circuit card carrier tape, unclad
€193.00
BS EN 62899-401. Printed electronics Part 401. Printability. Overview
€23.00
BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method
BS EN IEC 63203-402-2. Wearable electronic devices and technologies Part 402-2. Performance Measurement of Fitness Wearables. Step Counting
BS IEC 62899-203-2 Printed electronics Materials - Semiconductor Ink- Space charge limited mobility measurement in printed organic semiconductive layers
BS IEC 63240-1. Active assisted living (AAL) reference architecture and model Part 1. Reference
BS EN IEC 63267-3-81. Fibre optic interconnecting devices and passive components. Connector optical interfaces for enhanced Macro bend multimode fibre Part 3-81. parameters of physically contacting 50 µm core diameter fibres. Non-angled polyphenylene sulphide rectangular ferrules with a single row 12, 8, 4, or 2 fibres reference connector applications
BS EN IEC 62899-402-1. Printed electronics Part 402-1. Printability. Measurement of qualities. Line pattern widths
BS IEC 62899-302-7. Printed electronics Part 302-7. Equipment. Measurement methods for Inkjet printing dot placement evaluation printed
BS EN IEC 61249-2-52 Materials for printed boards and other interconnecting structures Part 2-52. Reinforced base materials clad unclad. Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
BS IEC 62899-202-11. Printed electronics Part 202-11. Materials. Conductive ink. Measurement method of electrical resistance uniformity for large area printed conductive layer
BS IEC 62899-402-8. Printed electronics Part 402-8. Printability. Measurement of qualities. Shape pattern dimension
BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
BS IEC 62899-402-2 Printed electronics Part 402-2: Printability - Measurement of qualities Edge waviness printed pattern using a two-dimensional optical image
BS IEC 62899-403-2 Printed electronics Part 403-2: Printability - Requirements for reproducibility Basic patterns printing plate
