BS EN 60947-4-3. Low-voltage switchgear and controlgear Part 4-3. Contactors motor-starters. Semiconductor controllers semiconductor contactors for non-motor loads
€23.00
Printed electronics Printability. Requirements for reproducibility. Basic patterns evaluation of printing machine
€269.00
Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
€176.00
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
€22.00
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
€193.00
Printed electronics Equipment. Roll-to-roll printing. Mechanical dimensions
€165.00
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017.
€122.34
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017.
€105.42
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) defined flammability (vertical burning test), copper-clad lead-free assembly
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) defined flammability (vertical burning test), copper-clad lead-free assembly
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) defined flammability (vertical burning test), copper-clad lead-free assembly
Test methods for electrical materials, printed board and other interconnection structures assemblies General test method materials assemblies. Conductive anodic filaments (CAF) testing of circuit boards
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-45 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non tissé époxyde non halogéné, de conductivité thermique 1,0 W/(m•K) et d'inflammabilité définie (essai de combustion verticale), plaquées cuivre pour les assemblages sans plomb
€82.00
Space product assurance - Design rules for printed circuit boards
€285.00
