31.180 : Printed circuits and boards

DIN EN IEC 61188-6-4:2020-04

DIN EN IEC 61188-6-4:2020-04

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Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019); German version EN IEC 61188-6-4:2019

€140.00

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PD IEC TR 61191-7:2020

PD IEC TR 61191-7:2020

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Printed board assemblies Technical cleanliness of components and printed

€404.00

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IEC TR 61191-7:2020

IEC TR 61191-7:2020

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IEC TR 61191-7:2020 Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

€446.00

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DIN EN 61191-2 Berichtigung 1:2020-02

DIN EN 61191-2 Berichtigung 1:2020-02

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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017/COR1:2019); German version EN 61191-2:2017/AC:2019

€0.00

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BS EN IEC 62878-1:2019

BS EN IEC 62878-1:2019

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Device embedding assembly technology Generic specification for device embedded substrates

€269.00

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NF EN IEC 62878-1, C93-778-1 (12/2019)

NF EN IEC 62878-1, C93-778-1 (12/2019)

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Device embedding assembly technology - Part 1 : generic specification for device embedded substrates - Techniques d'assemblage avec appareil(s) intégré(s) - Partie 1 : Spécification générique pour substrats avec appareil(s) intégré(s)

€111.67

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19/30396945 DC:2019

19/30396945 DC:2019

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BS EN IEC 63251. Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress

€23.00

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BS EN IEC 62878-2-5:2019

BS EN IEC 62878-2-5:2019

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Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate

€374.00

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NF EN IEC 62878-2-5, C93-778-2-5 (11/2019)

NF EN IEC 62878-2-5, C93-778-2-5 (11/2019)

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Device embedding assembly technology - Part 2-5 : guidelines - Implementation of a 3D data format for device embedded substrate - Substrat avec appareil(s) intégré(s) - Partie 2-5 : Mise en oeuvre d'un format de données 3D pour un substrat avec appareil(s) intégré(s)

€166.33

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IEC 62878-1:2019

IEC 62878-1:2019

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Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

€127.00

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DIN EN 16602-70-60:2019-10

DIN EN 16602-70-60:2019-10

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Space product assurance - Qualification and Procurement of printed circuit boards; English version EN 16602-70-60:2019, only on CD-ROM.

€385.89

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19/30400602 DC:2019

19/30400602 DC:2019

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BS EN IEC 63203-301-1. Wearable electronic devices and technologies Part 301-1. Test method of electrochromic films for wearable equipments

€23.00

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IEC 62878-2-5:2019

IEC 62878-2-5:2019

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Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

€369.00

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18/30379177 DC:2019

18/30379177 DC:2019

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BS EN IEC 63203-401-1. Wearable electronic devices and technologies Part 401-1. Devices Systems. Functional elements. Evaluation method of the stretchable resistive strain sensor

€23.00

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PR NF IEC 60194-1, C93-730-1PR (09/2019)

PR NF IEC 60194-1, C93-730-1PR (09/2019)

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Conception, fabrication et assemblage de cartes imprimées - Vocabulaire - Partie 1 : Usage commun des techniques d'assemblage des composants électroniques et des cartes imprimées

€221.00

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