Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-46 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non tissé époxyde non halogéné, de conductivité thermique 1,5 W/(m•K) et d'inflammabilité définie (essai de combustion verticale), plaquées cuivre pour les assemblages sans plomb
€82.00
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-47 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non tissé époxyde non halogéné, de conductivité thermique 2,0 W/(m•K) et d’inflammabilité définie (essai de combustion verticale), plaquées cuivre pour les assemblages sans plomb
Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
€176.00
Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017); German version EN 61189-5-503:2017
€111.40
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017.
€105.42
Printed board assemblies Sectional specification. Requirements for terminal soldered
€269.00
Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
Printed boards and printed board assemblies. Design use Electronic component zero orientation for CAD library construction
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503 : general test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
€111.67
IEEE Standard for High-Speed Test Access Port and On-Chip Distribution Architecture
€101.00
Printed boards and printed board assemblies - Design and use - Part 7 : electronic component zero orientation for CAD library construction
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
