Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
€176.00
Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Test methods for electrical materials, printed boards and other interconnection structures assemblies (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
€193.00
Device embedded substrate - Part 1-1: Generic specification - Test methods (IEC 62878-1-1:2015); German version EN 62878-1-1:2015
€162.06
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015); German version EN 61189-2-721:2015
€111.40
Printed electronics - Part 201: Materials - Substrates
€325.00
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
€44.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
€231.00
Device embedded substrate Guidelines. Electrical testing
Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials
€88.00
Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
Device embedded substrate - Part 2-2: Guidelines - Electrical testing
