Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015.
€111.40
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015); German version EN 61189-5-2:2015.
€140.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN 61189-5-3:2015.
€145.14
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721 : test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator - Méthodes d'essais pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-721 : méthodes d'essai des matériaux pour structures d'interconnexion - Mesure de la permittivité relative et de la tangente de perte pour les
€111.67
Device embedded substrate - Part 1-1 : generic specification - Test methods - Substrat intégré à l'appareil
€166.33
Device embedded substrate Generic specification. Test methods
€374.00
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Measurement of relative permittivity loss tangent copper clad laminate at microwave frequency using split post dielectric resonator
€269.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3 : general test methods for materials and assemblies - Soldering paste for printed board assemblies
€138.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2 : general test methods for materials and assemblies - Soldering Flux for printed board assemblies
€153.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4 : general test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for wire for printed board assembies
Device embedded substrate - Part 1-1: Generic specification - Test methods
€369.00
Device embedded substrate Guidelines. General description of technology
€316.00
Device embedded substrate Guidelines. Test element groups (TEG)
Device embedded substrate Guidelines. Design guide
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Soldering flux board
€355.00
