Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for through hole components (THT)
€316.00
Test methods for electrical materials, circuit boards and other interconnection structures assemblies X/Y coefficient of thermal expansion (CTE) test thick base materials by TMA
€165.00
Low-voltage switchgear and controlgear Contactors motor-starters. Semiconductor controllers semiconductor contactors for non-motor loads
€404.00
Classification of shapes of electronic components for placement on printed wiring boards
Printed electronics Part 403-2: Printability - Requirements for reproducibility Basic patterns printing plate
€269.00
Materials for printed boards and other interconnecting structures Part 2-52: Reinforced base materials clad unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad — PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
Test methods for electrical materials, printed boards and other interconnection structures assemblies Detection of plating defects in unpopulated circuit by computed tomography (CT)
IEEE Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device
€275.00
IEEE Standard for a Mixed-Signal Test Bus
€248.00
IEEE Standard for Test Access Port and Boundary-Scan Architecture
€310.00
IEEE Standard for Boundary-Scan-Based Stimulus of Interconnections to Passive and/or Active Components
€103.00
IEEE Standard for High-Speed Test Access Port and On-Chip Distribution Architecture
€101.00
IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz
€156.00
Digital data communications for measurement and control. Fieldbus use in industrial control systems Overview guidance the IEC 61158 series
