Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
€88.00
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (IEC 61193-3:2013); German version EN 61193-3:2013
€173.74
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11 : measurement of melting temperature or melting temperature ranges of solder alloys
€82.00
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-27:2012); German version EN 61249-2-27:2013
€105.42
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (IEC 61249-2-30:2012); German version EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-39:2012); German version EN 61249-2-39:2013
€111.40
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-40:2012); German version EN 61249-2-40:2013
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description (IEC 61182-2-2:2012); German version EN 61182-2-2:2012
€150.65
Materials for printed boards and other interconnecting structures - Part 2-30 : reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures - Part 2-27 : reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Sectional specification : single and double sided printed boards with plated-through holes
€59.33
Sectional Specification : single and double sided printed boards with plated-through holes
€111.67
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3 : test methods for interconnection structures (printed boards)
€245.00
Système d'assurance de la qualité - Partie 3 : choix et utilisation de plans d'échantillonnage pour cartes imprimées et produits finis stratifiés et audits en cours de fabrication
€156.67
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-40 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées en tissu de verre de type E époxyde non halogéné à haute performance, plaquées cuivre, d'inflammabilité définie (essai de combustion verticale), pour les assemblages sans plomb
€93.67
