Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-39 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées en tissu de verre de type E époxyde et non époxyde à haute performance, plaquées cuivre, d'inflammabilité définie (essai de combustion verticale), pour les assemblages sans plomb
€93.67
Test methods for electrical materials, printed boards and other interconnection structures assemblies Measurement of melting temperature or ranges solder alloys
€193.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
€88.00
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
€269.00
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. High performance epoxide non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
€176.00
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Fibre optic interconnecting devices and passive components. connector interfaces Interface standard for LC connectors with protective housings related to IEC 61076-3-106
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed fabrication
€355.00
Cartes à circuits optiques - Norme de performance - Partie 3-1 : cartes à circuits optiques souples utilisant des fibres optiques en silice non connectorisées
€65.33
Optical amplifiers. Test methods Gain transient parameters. Broadband source method
