Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
€176.00
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
€286.00
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-14:2009); German version EN 61249-4-14:2009
€91.03
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-16:2009); German version EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-15:2009); German version EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-17:2009); German version EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
€193.00
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
Optical circuit boards - Part 3-1: Performance standards - Flexible optical circuit boards using unconnectorized optical glass fibres
€88.00
Materials for printed boards and other interconnecting structures - Part 2-38 : reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
€82.00
Cartes à circuits optiques - Partie 1 : généralités
Optical circuit boards General
€269.00
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-36:2008); German version EN 61249-2-36:2009
€111.40
