Materials for printed boards and other interconnecting structures - Part 2-44 : reinforced base materials clad and unclad - Non halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly - Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-44 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non-tissé époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de
€111.67
Connectors for electronic equipment - Part 7 : detail specification for 8-way, unshielded, free and fixed connectors
€145.67
Sectional Specifications : single and double-sided printed boards with plain holes
€109.00
Sectional specification : multilayer printed boards
€123.00
Sectional specification : flexible printed boards without through connections
Sectional specification : flexible printed boards with through connections
Sectional specification : flexible multilayer printed boards with through connections
€149.33
€58.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719 : test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling - Méthodes d'essai pour les matériaux électriques, les cartes imprimées, et autres structures d'interconnexion et ensembles - Partie 3-719 : méthodes d'essai pour les structures d'interconnexion (cartes imprimées) - Contrôles de la variation de résistance des trous métallisés uniques (PTH) au cours
€95.67
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-1 : méthodes d'essai générales pour les matériaux et assemblages - Lignes directrices pour les assemblages de cartes à circuit imprimé
Materials for printed boards and other interconnecting structures - Part 2-37 : reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Materials for printed boards and other interconnecting structures - Part 4-17 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Materials for printed boards and other interconnecting structures - Part 4-16 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
