Materials for printed boards and other interconnecting structures - Part 4-15 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
€95.67
Materials for printed boards and other interconnecting structures - Part 2-38 : reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
€111.67
Additif 1 à la publication UTE C 93-751 de novembre 1985
€93.67
Electronic components. Guidelines for artwork.
€82.00
Electronic components. Specification for interconnection multiwire printed boards.
€65.33
Base materials for printed circuits. Part 1 : test methods.
€119.48
Materials for interconnection structures. Part 7 : sectional specification set for restraining core materials. Section 1 : copper/invar/coper.
€59.33
Electronic components. Characteristics and control of thermal drains. - Composants électroniques - Cartes imprimées
Electronic components. Printed wiring. Design and use of printed boards. Design of solder mask coating.
€43.67
Electronic components. Printed wiring. Design and use of printed boards. Guide for the design of solder mask coating.
Electronic components. Printed boards. Test methods. - Composants électroniques
€184.00
Electronic components. Base material for printed circuits. General requirements.
€77.67
Electronic components. Base materials for printed circuits. Detail specifications.
€107.33
Materials for printed boards and other interconnecting structures - Part 4-2 : sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
Materials for printed boards and other interconnecting structures - Part 4-5 : sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
