Grid systems for printed circuits.
€59.33
Electronic components. Guide for the design and use of printed boards.
€207.67
Low-voltage switchgear and controlgear - Part 7-4 : ancillary equipment - PCB terminal blocks for copper conductors
€138.00
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-630 : méthodes d'essai des matériaux pour structures d'interconnexion - Absorption d'humidité après conditionnement dans un récipient sous pression
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504 : general test methods for materials and assemblies - Process ionic contamination testing (PICT)
€111.67
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-36:2008); German version EN 61249-2-36:2009
€111.40
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-35:2008); German version EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-37:2008); German version EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-38:2008); German version EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (IEC 61249-4-1:2008); German version EN 61249-4-1:2008
€84.58
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006); German version EN 61189-2:2006.
€261.78
Printed board design, manufacture and assembly - Terms and definitions (IEC 60194:2006); German version EN 60194:2006, text in English
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006); German version EN 61189-6:2006
€122.34
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006); German version EN 61189-5:2006.
€150.65
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008.
€288.60
