Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Soldering paste board
€355.00
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Solder alloys fluxed non-fluxed solid wire board
€269.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
€176.00
Device embedded substrate - Part 2-1: Guidelines - General description of technology
€231.00
Device embedded substrate - Part 2-3: Guidelines - Design guide
Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
€286.00
Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits
€11.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
€325.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
€404.00
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
€132.00
Low-voltage switchgear and controlgear Contactors motor-starters. AC semiconductor controllers contactors for non-motor loads
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-18:2013); German version EN 61249-4-18:2013
€91.03
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-19:2013); German version EN 61249-4-19:2013
