Process assessment schedule for printed board design facilities
€316.00
Printed boards Generic specification
€269.00
Specifications Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication multilayer printed boards
€193.00
Specification for metal-clad base materials printed circuits Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade: EP-GC-Cu-2
Specification for metal-clad base materials printed circuits Epoxide woven glass fabric copper-clad laminated sheet, flame retardant grade: EP-GC-Cu-3
Specification for metal-clad base materials printed circuits Phenolic cellulose paper copper-clad laminated sheet of high electrical quality, flame retardant grade: PF-CP-Cu-8
Specification for metal-clad base materials printed circuits Flexible copper-clad polyester (PETP) film: PETP-F-Cu-9
Specification for metal-clad base materials printed circuits Bonding sheet material use in the fabrication of multilayer boards: EP-GC-11
€165.00
Specification for metal-clad base materials printed circuits Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability use in the fabrication multilayer boards: EP-GC-Cu-12
Specification for metal-clad base materials printed circuits Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality and defined flammability: grade PF-CP-Cu-14
Specification for metal-clad base materials printed circuits Epoxide glass-reinforced copper-clad laminated sheet of defined flammability: EP-GCA-Cu-16
Specification for grid system for printed circuits
€95.00
Marking inks and solder resist coating materials for printed circuits Specification
Marking inks and solder resist coating materials for printed circuits Specification permanent polymer (dry film mask) material
Printed wiring boards Guide for the design and use of printed
