BS IEC 62899-402-2 Printed electronics Part 402-2: Printability - Measurement of qualities Edge waviness printed pattern using a two-dimensional optical image
€23.00
BS EN IEC 61249-3-6. Materials for printed boards and other interconnecting structures Part 3-6. Sectional specification set unreinforced base materials, clad unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-720 : détection de défauts présents dans les structures d'interconnexion par mesurage de la capacité
€70.50
Wearable electronic devices and technologies Performance measurement of fitness wearables. Step counting
€269.00
Printed electronics Materials. Conductive ink. Measurement of difference in resistance printing direction conductive film fabricated with wire-shaped materials
€193.00
Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials
€88.00
BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
€44.00
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
€165.00
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad (IEC 61249-2-51:2023); German version EN IEC 61249-2-51:2023
€98.32
Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
BS IEC 62899-402-8. Printed electronics Part 402-8. Printability. Measurement of qualities. Shape pattern dimension
Test methods for electrical materials, printed boards and other interconnection structures assemblies Thermal conductivity test base materials
Test methods for electrical materials, printed board and other interconnection structures assemblies time to delamination. T260, T288, T300
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
