Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 61189-2-804:2023); German version EN IEC 61189-2-804:2023
€63.27
BS EN IEC 63516 Fixed folding durability test method for flexible opto-electric circuit boards
€23.00
BS EN IEC 61249-2-54 Materials for printed boards and other interconnecting structures Part 2-54. Reinforced base materials clad unclad. Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) flammability (vertical burning test), copper-clad high speed applications
BS ISO 13060 An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 61189-2-801:2023); German version EN IEC 61189-2-801:2023
€77.20
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023
Test methods for electrical materials, printed board and other interconnection structures assemblies Thermal resistance of an assembly by thermal transient method
€269.00
Test methods for electrical materials, printed boards and other interconnection structures assemblies X/Y CTE test thin base materials by TMA
€165.00
BS IEC 62899-403-2 Printed electronics Part 403-2: Printability - Requirements for reproducibility Basic patterns printing plate
Wearable electronic devices and technologies Test method of electrochromic films for wearable equipment
€193.00
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures et assemblages d'interconnexion - Partie 2-808 : résistance thermique d'un assemblage par la méthode du transitoire thermique
€111.67
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-805 : essai à faible CDT X/Y par TMA pour matériaux de base minces
€77.67
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
€127.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
€44.00
Test methods for electrical materials, circuit boards and other interconnection structures assemblies Detection of defects in by measurement capacitance
