Enabling Circular Economy Practices: Repair and Recycling of PBAs
€163.00
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad — PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
€269.00
Test methods for electrical materials, printed boards and other interconnection structures assemblies Detection of plating defects in unpopulated circuit by computed tomography (CT)
Draft BS EN 61189-5-501 Test methods for electrical materials, printed boards and other interconnection structures assemblies Part 5-501: General test materials - Surface insulation resistance (SIR) testing of solder fluxes
€23.00
Materials for printed boards and other interconnecting structures Part 2-52: Reinforced base materials clad unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA (IEC 61189-2-809:2024); German version EN IEC 61189-2-809:2025
€77.20
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV:2024); German and English version prEN IEC 61189-3-302:2024
€105.42
Matériaux pour circuits imprimés et autres structures d’interconnexion - Partie 2-53 : Matériaux de base renforcés, métallisés et non métallisés - Feuilles stratifiées non chargées en PTFE d’inflammabilité définie (essai de combustion verticale), plaquées cuivre
€82.00
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 3-302: Détection des défauts de métallisation dans les cartes de circuits imprimés nus par tomographie informatisée (TI)
€74.00
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-54: Matériaux de base renforcés, plaqués et non plaqués - Système de résine halogénée modifiée ou non modifiée, feuilles stratifiées en tissu de verre E de facteur de dissipation (inférieur à 0,005 à 10 GHz) et inflammabilité définis (essai de combustion verticale), plaquées cuivre pour applications à grande vitesse
€70.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
€127.00
Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
€176.00
Méthode d’essai de durabilité au pliage fixe pour les circuits optoélectriques souples
€61.00
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (IEC 61189-2-808:2024); German version EN IEC 61189-2-808:2024
