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26/30566055 DC:2026
BS EN IEC 61249-2-56 Materials for printed boards and other interconnecting structure Part 2-56: Reinforced base materials clad unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion flammability (vertical burning test), copper-clad IC substrate
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Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 07/03/2026 |
| Page Count | 27 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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01/04/1996
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08/08/2024
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