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IEC 61249-3-5:1999
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
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Summary
Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 02/10/1999 |
| Release Date | 02/10/1999 |
| Edition | 1 |
| Page Count | 25 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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