31.180 : Printed circuits and boards

UNE-EN 60947-4-3:2002/A2:2013

UNE-EN 60947-4-3:2002/A2:2013

Superseded Historical

Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads

€58.00

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DIN IEC 91(Sec)25:1993-09

DIN IEC 91(Sec)25:1993-09

Withdrawn Most Recent

Test methods of resistance to force; identical with IEC 91(Secretariat)25:1993

€69.91

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DIN IEC 91(Sec)27:1993-09

DIN IEC 91(Sec)27:1993-09

Withdrawn Most Recent

Test methods for soldering of surface mounting devices (SMDs); identical with IEC 91(Secretariat)27:1993

€84.58

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DIN IEC 60326-3:1993-09

DIN IEC 60326-3:1993-09

Withdrawn Most Recent

Printed boards; part 3: design and use of printed boards; identical with IEC 60326-3:1991

€105.42

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DIN IEC 60326-4:1993-09

DIN IEC 60326-4:1993-09

Withdrawn Most Recent

Printed boards; part 4: specification for single and double sided rigid printed boards with plain holes; identical with IEC 60326-4:1980 (status as of 1989)

€63.27

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DIN IEC 60326-5:1993-09

DIN IEC 60326-5:1993-09

Withdrawn Most Recent

Printed boards; part 5: specification for single and double sided printed boards with plated-through holes; identical with IEC 60326-5:1980 (status as of 1989)

€77.20

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DIN IEC 60326-2/A1:1993-10

DIN IEC 60326-2/A1:1993-10

Withdrawn Most Recent

Printed boards; part 2: test methods; identical with IEC 60326-2 A1:1992

€34.30

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DIN IEC 52(Sec)422:1993-11

DIN IEC 52(Sec)422:1993-11

Superseded Historical

IEC 61189-2: test methods for materials for interconnection structures, test M14: peel strength after heat shock (IEC 52(Secretariat)422:1993)

€41.78

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DIN IEC 52(Sec)425:1993-11

DIN IEC 52(Sec)425:1993-11

Superseded Historical

IEC 61189-2: test methods for materials for interconnection structures, test M17: peel strength at high temperature (IEC 52(Secretariat)425:1993)

€41.78

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DIN IEC 52(Sec)426:1993-11

DIN IEC 52(Sec)426:1993-11

Superseded Historical

IEC 61189-3: test methods for interconnection structures (printed boards), test M05: peel strength, flexible printed boards, STD (IEC 52(Secretariat)426:1993)

€41.78

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DIN EN 60249-2-16:1993-12

DIN EN 60249-2-16:1993-12

Superseded Historical

Base materials for printed circuits; part 2: specifications; specification No. 16: polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) (IEC 60249-2-16:1992); German version EN 60249-2-16:1993.

€63.27

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DIN EN 60249-2-17:1993-12

DIN EN 60249-2-17:1993-12

Superseded Historical

Base materials for printed circuits; part 2: specifications; specification No. 17: thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board (IEC 60249-2-17:1992 + corrigendum 1992); German version EN 60249-2-17:1993.

€56.17

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DIN EN 60249-2-18:1993-12

DIN EN 60249-2-18:1993-12

Superseded Historical

Base materials for printed circuits; part 2: specifications; specification No. 18: bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) (IEC 60249-2-18:1992); German version EN 60249-2-18:1993.

€63.27

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DIN EN 60249-2-19:1993-12

DIN EN 60249-2-19:1993-12

Withdrawn Most Recent

Base materials for printed circuits; part 2: specifications; specification No. 19: thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards (IEC 60249-2-19:1992); German version EN 60249-2-19:1993

€56.17

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DIN IEC 52(Sec)360:1992-12

DIN IEC 52(Sec)360:1992-12

Superseded Historical

Printed boards; generic specification; identical with IEC 52(Secretariat)360

€91.03

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