Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
€88.00
Printed boards and assemblies. Design use. Generic requirements requirements. Controlled impedance
€316.00
Harmonized system of quality assessment for electronic components. Blank detail specification: printed board assembly modular electronic units of assessed quality. Capability approval
€193.00
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Test methods for electrical materials, interconnection structures and assemblies. Part 1 : general test methods and methodology.
€95.67
Printed boards. Part 4 : rigid multilayer printed boards with interlayer connections. Sectional specification. - Cartes imprimées
€138.00
Cartes imprimées - Partie 4 : cartes imprimées multicouches rigides avec connexions intercouches. Spécification intermédiaire - Section 1 : spécification particulière d'agrément niveaux de performance A, B et C.
€184.00
Materials for interconnection structures. Part 8 : sectional specification set for non-conductive films and coatings. . Section 8 : temporary polymer coatings. - Matériaux pour les structures d'interconnexion
€77.67
Connecteurs pour fréquences inférieures à 3 MHz pour utilisation avec cartes imprimées - Partie 8 : connecteurs pour cartes imprimées en deux parties, pour grille de base de 2,54 mm (0,1 in) à contacts mâles de section 0,63 mm X 0,63 mm.
€153.00
Connecteurs pour fréquences inférieures à 3 MHz pour utilisation avec cartes imprimées - Partie 5 : connecteurs encartables et connecteurs enfichables pour cartes imprimées double face au pas de 2,54 mm (0,1 in).
€126.00
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections
€269.00
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plain holes
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections
