Base materials for printed circuits; special materials; specification no. 2: copper foil for use in the manufacture of copper-clad base materials; identical with IEC 52(Secretariat)352
€63.27
Printed board electronic data description and transfer; part 1: printed board description in digital form; identical with IEC 52(Central Office)363
€84.58
Printed boards; part 12: specification for mass lamination panels (semi-manufactured multilayer printed boards); identical with IEC 12(Central Office)367
€48.79
Printed boards; part 2: test methods; identical with IEC 60326-2:1990
€111.40
IEC TR 62878-2-2:2015 Device embedded substrate - Part 2-2: Guidelines - Electrical testing
€93.00
IEC 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
€46.00
IEC 61189-3-913:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
€244.00
IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
€342.00
IEC 61249-2-44:2016 Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
€186.00
IEC 61249-2-43:2016 Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IEC 61189-2-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
€133.00
IEEE Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding
€68.00
Rack and panel connectors; trapeziodal, round contacts 1 mm; dimensions of type B; solder termination for printed board
Printed boards; artwork for production; identical with IEC 52(Central Office)303
€56.17
