31.180 : Printed circuits and boards

UNE-EN 60249-2-7:1996

UNE-EN 60249-2-7:1996

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BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 7: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).

€63.00

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UNE-EN 60249-2-8:1996

UNE-EN 60249-2-8:1996

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BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.

€56.00

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UNE-EN 60249-2-9:1996

UNE-EN 60249-2-9:1996

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BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 9: EPOXIDE CELLULOSE PAPER CORE, EPOXIDE GLASS CLOTH SURFACE COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).

€63.00

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UNE-EN 60249-2-10:1996

UNE-EN 60249-2-10:1996

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BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 10: EPOXIDE NON-WOVEN/WOVEN GLASS REINFORCED COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILIY (VERTICAL BURNING TEST).

€63.00

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UNE-EN 60249-2-11:1996

UNE-EN 60249-2-11:1996

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BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.

€59.00

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UNE-EN 60249-2-12:1996

UNE-EN 60249-2-12:1996

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BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.

€59.00

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UNE-EN 60249-2-13:1996

UNE-EN 60249-2-13:1996

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BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.

€61.00

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UNE-EN 60249-2-14:1996

UNE-EN 60249-2-14:1996

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BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 14: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), ECONOMIC QUALITY.

€63.00

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UNE-EN 60249-2-15:1996

UNE-EN 60249-2-15:1996

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BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.

€61.00

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IEC 61249-5-4:1996

IEC 61249-5-4:1996

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Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks

€88.00

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DIN EN 61249-5-1:1996-06

DIN EN 61249-5-1:1996-06

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Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings; section 1: Copper foils (for the manufacturer of copper-clad base materials) (IEC 61249-5-1:1995); German version EN 61249-5-1:1996

€56.17

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IEC 61249-8-7:1996

IEC 61249-8-7:1996

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Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

€88.00

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BS CECC 23100-003:1996

BS CECC 23100-003:1996

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Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes

€269.00

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BS CECC 23200-003:1996

BS CECC 23200-003:1996

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Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes

€269.00

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BS CECC 23300-003:1996

BS CECC 23300-003:1996

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Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards

€316.00

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